◆Viewing angle:120 deg
發(fā)光角度：120℃
◆The materials of the LED dice is InGaN
芯片成分
◆2.0mm×1.2mm×0.75mm T-LED
外型尺寸
◆Lens Appearance: Water Clear
膠體顏色：水色透明
◆ RoHS compliant lead-free soldering compatible
合ROHS（危害物質(zhì)禁用指令）要求。
信賴(lài)性試驗(yàn)
| 試驗(yàn)類(lèi)別Clification | 試驗(yàn)項(xiàng)目 Test Item | 試驗(yàn)條件 Test Condition | 試驗(yàn)設(shè)備 Test Equipment | 樣品數(shù) Sample Size | 失敗率 Failure Rate |
| 耐久性試驗(yàn) Endurance Test | 室溫通電試驗(yàn) Operation Life | Temp=(25&plun;5)℃ RH=(50&plun;10)%IF=20mA or 30mA or 50mACheck point: 0hr; 125hrs; 500hrs; 1000hrs | 燒機(jī)板 Burn in board | 20 | 0 |
| 高溫高濕儲(chǔ)存試驗(yàn) High Temperature High Humidity Storage | Temp=(85&plun;5)℃ RH=(90%~95%) Check point: 0hr; 125hrs; 500hrs; 1000hrs | 可程式恒溫恒濕試驗(yàn)機(jī) Programmable Temp & Humidity Chamber | 20 | 0 | |
| 高溫高濕反向耐壓試驗(yàn) High Temperature High HumidityReverse Bias | Temp=(85&plun;5)℃ RH=(90%~95%) VR=5V Check point: 0hr; 125hrs; 500hrs; 1000hrs | 可程式恒溫恒濕試驗(yàn)機(jī) DC=5V電源Programmable Temp & Humidity ChamberPower:DC=5V | 20 | 0 | |
| 高溫儲(chǔ)存試驗(yàn) High Temperature Storage | High Temp=(85&plun;5)℃ Check point: 0hr; 125hrs; 500hrs; 1000hrs | 烤箱 Oven | 20 | 0 | |
| 低溫儲(chǔ)存試驗(yàn) Low Temperature Storage | Low Temp=(-30&plun;5)℃ Check point: 0hr; 125hrs; 500hrs; 1000hrs | 可程式恒溫恒濕試驗(yàn)機(jī) Programmable Temp & Humidity Chamber | 20 | 0 | |
| 環(huán)境試驗(yàn) EnvironmentalTest | 溫度循環(huán)試驗(yàn) Temperature Cycle Test | (85&plun;5) ℃ ~ ( -30℃&plun;5) ℃ ~ (85&plun;5) ℃30min 120min 30 min 100minTest time: 0 cycle 10cycle 50cycle 100cycle | 可程式恒溫恒濕試驗(yàn)機(jī) Programmable Temp & Humidity Chamber | 20 | 0 |
| 冷熱沖擊試驗(yàn) Thermal Shock Test | (110&plun;5) ℃ ~ ( -30℃&plun;5) ℃ ~ (110&plun;5) ℃15min 8min 15 min 8minTest time: 0 cycle 10cycle 50cycle 100cycle | 氣體式冷熱沖擊試驗(yàn)機(jī) Thermal Shock Tester (Air to Air) | 20 | 0 | |
| 回流焊試驗(yàn) Solder Resistance | Temp=260&plun;5℃ Dwell Time=10&plun;1sec; Test times=5 times | 回流焊試驗(yàn)機(jī) Reflow Oven | 20 | 0 | |
| 焊接特性試驗(yàn) Solder ability | Temp=230&plun;5℃ Dwell Time=5&plun;1sec; | 錫爐 Tin furnace | 20 |
※Precautions for use使用規(guī)范
Reflow Profile回流焊規(guī)范
Pb-free Solder temperature Profile無(wú)鉛產(chǎn)品回流焊溫度條件曲線規(guī)范
Note: a)Reflow soldering should not be done more than two times.
材料焊接次數(shù)不過(guò)2次。
b)Do not put stress on the LEDs when soldering.
焊接時(shí)請(qǐng)不要重壓LED燈。
c)Do not warp the circuit board before it have been returned to normal ambient conditions
after soldering.
焊接后溫度未回降到常溫時(shí)請(qǐng)勿扭曲線路板。
Hand Soldering Profile手工焊接規(guī)范
The temperature of the iron should be lower than 300℃and soldering within 3sec per solder-pad
is to be observed.
手工焊接時(shí)，烙鐵溫度不高于300℃，每個(gè)焊腳焊接時(shí)間不過(guò)3秒
Storage Profile貯存規(guī)范
1. Do not open the moisture proof bag before ready to use the LEDs
請(qǐng)?jiān)谖礈?zhǔn)備使用LED之前不要打開(kāi)靜電袋子。
2. The LEDs should be kept at 30℃or less and 60%RH or less before opening the package.
The max. storage period before opening the package is 1 year.
LED在未開(kāi)封之前應(yīng)保存在30℃以下，濕度在60%以下的環(huán)境中，長(zhǎng)保存期為1年。
3. After opening the package, the LEDs should be kept at 30℃/40%RH or less, and it should be
used within 7 days
打開(kāi)包裝待后，LED需保存在30℃/40%濕度以下的條件，且須在7天內(nèi)使用完。
4. If the LEDs be kept over the condition of 3, baking is required before mounting. Baking
condition as below: 60&plun;5℃for 12 hours
如果LED出了第3點(diǎn)要求，則LED須經(jīng)過(guò)烘烤才能使用，烘烤條件為：60&plun;5℃，12個(gè)
小時(shí)
