型號(hào)：3528

規(guī)格：0.06W

色溫：2700-7000k

電流：20mA

流明：5-6LM

■   產(chǎn)品特性

l 發(fā)光效率高，光譜窄，單色性好

l 顯色性高，顯示色彩,色彩還原能力優(yōu)異

l  綠色。鉛、汞等有毒有害物質(zhì)

l 獲得科學(xué)技術(shù)成果鑒定

l  精密恒流，壽命達(dá)50000小時(shí)，低衰減

■   應(yīng)用領(lǐng)域

廣泛應(yīng)用于戶(hù)外廣告牌、電子顯示屏， 交通信號(hào)燈、標(biāo)志牌，汽車(chē)尾燈，,LED發(fā)光模組， LCD背光源、LED燈飾照明,LED軟/硬光條等。

■   實(shí)物圖

■   產(chǎn)品參數(shù)

Absolute Maximum Ratings at Ta = 25°C

限參數(shù)值(Ta=25°C)

TE: 1. Where pulse width <= 0.1msec, duty cycle <= 1/10

脈沖寬度小于等于0.1msec, 占空比小于等于1/10

2.Customer ackwledg that it should t operate the sampl beyond the level recommended in the specification Guidelin.

客戶(hù)清楚在使用樣品時(shí)不應(yīng)出規(guī)格書(shū)推薦以上的驅(qū)動(dòng)情況.

Tical Electrical & Optical Characteristics at Ta = 25°C                  

主要光電特性（Ta = 25°C）

TE: (Tolerance: Iv &plun;10%, Vf &plun;0.05V, X, Y &plun;0.05)

注：（公差：發(fā)光強(qiáng)度&plun; 10％，電壓&plun; 0.05V，X，Y &plun; 0.05）

■Reflow profile

 回流溫度曲線(xiàn)

Recommended soldering conditions
推薦焊接條件

Temperature-profile (Surface of circuit board), Use the following conditions shown in the figure.

溫度分布（電路板的表面）,使用如下圖所示條件.

1. Reflow soldering should t be done more than two tim

回流焊不應(yīng)該做2次以上

2. When soldering ,do t put strs on the LEDs during heating

焊接時(shí)，不要給加熱過(guò)程中的發(fā)光二管以壓力

Soldering iron 烙鐵焊接

1. When hand soldering, keep the temperature of the iron under 300℃, and at that temperature keep the time under 3sec.

當(dāng)手工焊接，保持在300℃，鐵的溫度，并在該溫度下保持3秒的時(shí)間。

2.when the temperature of 260℃, do t contact the rin when hand soldering，The basic spec is ≤5 sec.

當(dāng)260℃溫度，不接觸樹(shù)脂手工焊接時(shí)，基本的規(guī)范是≤5秒。

Rework  返工

1. Customer must finish rework within 5 sec under 260℃；

客戶(hù)須完成5秒內(nèi)260℃下返工；

2. The head of iron can t touch the silicone；

烙鐵頭不能接觸膠體；

3. Double-te soldering iron is preferred.

雙頭式烙鐵是.

CAUTIONS 注意事項(xiàng)

The encapsulated material of the LEDs is silicone . Therefore the LEDs have a soft surface on the of package. The prsure to the surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong prsure on the encapsulated part. So when using the picking up zzle, the prsure on the silicone rin should be proper.

LED的封裝材料是硅膠。因此，有一個(gè)發(fā)光二管對(duì)軟包的頂部表面。到頂部表面壓力會(huì)影響LED的性。應(yīng)當(dāng)采取措施，以避免對(duì)封裝的強(qiáng)烈壓力。因此，當(dāng)使用了噴嘴采摘，對(duì)硅樹(shù)脂壓力應(yīng)是適當(dāng)?shù)摹?/p>

■   Internal Packaging 內(nèi)包裝規(guī)格

采用編帶＋靜電袋包裝。

■T附注

1. Empty component pockets are sealed with cover tape;

空組件口袋蓋上頂蓋帶;

2. The maximum number of missing lamps is two;

缺少燈的數(shù)量為2;

3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications.

負(fù)是面向根據(jù)磁帶孔鏈輪與ANSI /環(huán)境影響評(píng)估的RS - 481規(guī)范。

4. 2,000 /1000pcs/ Reel.

2,000/1000顆/卷軸。

■

■CAUTIONS  注意事項(xiàng)

Storage conditions 貯存條件

Before opening the package:
打開(kāi)包裝前：

The LEDs should be kept at 30℃ or ls and 60%RH or ls. Under the conditions of upened storage time should t exceed six months, LED easy to absorb in the air due to moisture (silica gel), should be moisture-proof packaging vacuum.

這些LED應(yīng)保持在30℃以下，60％RH以下. 未拆封條件下儲(chǔ)存時(shí)間不可過(guò)六個(gè)月，由于（硅膠）容易吸收空氣中的水分，應(yīng)抽真空潮包裝。

After opening the package:

打開(kāi)包裝后：

（1）.The LEDs should be kept at 30℃ or ls and 60%RH or ls. The LEDs should be soldered within 24 hours (1days) opening the package. If unused LEDs remain, they should be stored in moisture proof packag, such as sealed containers

這些LED應(yīng)保持在30℃以下，60％RH以下。這些LED焊接應(yīng)在24小時(shí)內(nèi)（）打開(kāi)包裝。

如果未使用的發(fā)光二管下去，便應(yīng)存放在潮包裝，如密封的容器；

（2）.If exposed to the air more than 24 hours later, still continue to use, bulk material required to baking at 120 ℃ under 5 hours for the taping materials need to use 70 ℃ baking 12 hours before continuing use; re-use, exposure to time in the air is still more than 24 hours.

若暴露在空氣中過(guò)24小時(shí)后，仍需繼續(xù)使用，散裝材料需在120℃條件下烘烤5小時(shí)，對(duì)于編帶

材料需用70℃烘烤12小時(shí)后再繼續(xù)使用；再次使用時(shí)，暴露在空氣中時(shí)間仍不可過(guò)24小時(shí).

型號(hào)參數(shù)如下圖：