Features
?High reliability
?High radiant intensity
?Peak welength λp=850nm
?2.54mmLead spacing
?Low forward voltage
?The product itself will remain within RoHS compliant version.
Descriptions
?Xinghui’s Infrared Emitting Diode is a high intensity diode , molded in a water clear plastic package.
?The device is spectrally matched with phototransistor , photodiode and infrared receiver module.
Applications
?Free air tranission system
?Opto electronic switch
?Infrared applied system
?oke detector
Device Selection Guide
LED Part No. | Chip Material | Lens Color |
TKIRP5113 | GaAlAs | Water clear |
Package Dimensions
Absolute Maximum Ratings (Ta=25℃)
Parameter | Symbol | Rating | Unit |
Continuous Forward Current | IF | 80 | mA |
Peak Forward Current | IFP | 1 | A |
Reverse Voltage | VR | 5 | V |
Operating Temperature | Topr | -40 ~ +85 | ℃ |
Storage Temperature | Tstg | -40 ~ +85 | ℃ |
Soldering Temperature | Tsol | 260 | ℃ |
Power Dissipation at25℃Free Air Temperature | Pd | 150 | mW |
Notes:*1:IFPConditions--Pulse Width≦100μs and Duty≦1%.
*2:Soldering time≦5 seconds.
Electro-Optical Characteristics (Ta=25℃)
Parameter | Symbol | Condition | Min | T | Max | Unit |
Radiant Intensity | IE | IF=20mA | -- | 14 | -- | mW/sr |
Radiant Intensity | IE | IF=80mA | -- | 60 | -- | mW/sr |
Radiant Intensity | IE | IF=1A Pulse Width≦100μs ,Duty≦1% | -- | 950 | -- | mW/sr |
Peak Welength | λp | IF=20mA | -- | 850 | -- | nm |
Spectrial Bandwidth | Δλ | IF=20mA | -- | 45 | -- | nm |
Forward | VF | IF=20mA |
| 1.45 | 1.60 | V |
Forward | VF | IF=80mA | -- | 1.6 | -- | V |
Forward Voltage | VF | IF=1A Pulse Width≦100μs ,Duty≦1% | -- | 4.1 | 5.25 | V |
Reverse Current | IR | VR=5V | -- | -- | 10 | μA |
View Angle | 2θ1/2 | IF=20mA | -- | 45 | -- | deg |
1000PCS/Bag
Instructions
1. Lead Forming
a) During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
b) Lead forming should be done before soldering.
c) oid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs.
d) Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs.
e) When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.
2. Storage
a) The LEDs should be stored at 30°C or less and 70%RH or less after being shipped fromXinghuiand the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.
b) Please oid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur.
3. Soldering
a) Careful attention should be paid during soldering. When soldering, lee more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended.
b) Recommended soldering conditions:
Hand Soldering | DIP Soldering | ||
Temp. at tip of iron | 300℃Max. (60W Max.) | Preheat temp. | 100℃Max. (60 sec Max.) |
Soldering time | 3 sec Max. | Bathtemp. & time | 260 Max., 5 sec Max |
Distance | 3mmMin.(From solder joint to epoxy bulb) | Distance | 3mmMin. (From solder joint to epoxy bulb) |
Notes
1. Above specification may be changed without notice, XingHui will reserve authority on material change for above specification.
2. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. XingHui umes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets.
3. These specification sheets include materials protected under copyright of XingHui company. Please don’t reproduce or cause anyone to reproduce them without XingHui’s consent.
